Liquid Cooling

Liquid Cooling, From CDU to Facility Loop

The complete thermal chain for high-density AI computing: CDU architecture, coolant chemistry, loop topology, plumbing and the facility systems that reject the heat.

Core Architecture

Water Cooling CDU, Layer by Layer

Five functional layers make up the coolant distribution unit. Step through each one.

Layer 1 of 5

Exterior Frame

Front access door and rigid structural frame.

The outer enclosure protects every internal layer while keeping the front fully serviceable. Filtered intake panels and a rigid welded frame carry the full wet weight of the unit.

Exterior Frame exploded view
Layer 1 · Exterior Frame
Layer 2 of 5

Control Hub

Smart control panel for real-time telemetry.

A dedicated controls column carries the HMI, PLC and sensor wiring: real-time flow, temperature and pressure telemetry with alarm thresholds reported upstream to BMS.

Control Hub exploded view
Layer 2 · Control Hub
Layer 3 of 5

Circulation Core

High-efficiency pump module and expansion tank for pressure balancing.

Redundant pumps and an expansion tank keep the secondary loop moving at stable pressure. Pump modules are side-removable for service without draining the loop.

Circulation Core exploded view
Layer 3 · Circulation Core
Layer 4 of 5

Thermal Transfer

High-performance plate heat exchanger.

The plate heat exchanger is the boundary between facility water and the IT coolant loop: two hydraulic worlds exchange heat without ever mixing.

Thermal Transfer exploded view
Layer 4 · Thermal Transfer
Layer 5 of 5

Distribution

Flow-optimized manifold, particle filter, and precision flow / temperature sensors.

The manifold layer distributes conditioned coolant to rack supply lines: flow-optimized headers, dual particle filters and precision instrumentation on every branch.

Distribution exploded view
Layer 5 · Distribution
High Efficiency

Optimized hydraulics.

Modular Design

Rapid customization.

Smart Monitoring

Active risk mitigation.

Liquid Cooling Infrastructure

CDU Supports Serviceable Hydraulics up to 10 bar

Top-entry sanitary interfaces, 4 °C approach heat exchange and high-availability protections for high-density liquid cooling.

0°CHeat Exchanger ATDOversized plate heat exchanger
50/55psiPump DutyHigh-head VFD pump, side-removable
0barWorking PressureFWS and TCS maximum, 145 psi
18–50°COperating LimitInstallation altitude up to 3000 m
1 · Physical & Service Access
  • Enclosure: 1100 W × 1200 D × 2200 H mm
  • Maintenance: front 1200 mm; each side 650 mm; rear 150 mm
  • Top connections: FWS / TCS 4 in Tri-clamp; fill port 1 in Tri-clamp
2 · Cooling & Hydraulic System
  • Oversized plate heat exchanger: 4 °C ATD
  • High-head VFD pump: 50 psi rated / 55 psi nominal; side-removable
  • TCS: dual 25 µm filters | FWS: two-way control valve
  • Integrated automatic glycol feeder
3 · Operating Envelope & Reliability
  • Ambient 18–50 °C; altitude up to 3000 m
  • FWS: water or ≤40% ethylene glycol | TCS: PG25 (25% propylene glycol)
  • Dual power with electromechanical switch; rope-type leak detection
Cooling Comparison

Air vs. Liquid Cooling

Scenario A: Air Cooling
Air cooling scenario: fans, chiller and CRAH move heat with high energy
  • Traditional server rack in hot-aisle / cold-plenum layout
  • Fans on every server push heat into the room
  • Chiller and CRAH units work at high energy to remove it
  • Energy hogs: fans and chiller
PUE ~1.50 (IT + air cooling + other) / IT power
Scenario B: Liquid Cooling
Liquid cooling scenario: cold plates and CDU carry heat through the facility water loop
  • Advanced high-density rack with custom cold plates on every CPU / GPU
  • Cool dielectric fluid carries heat straight off the silicon
  • CDU and heat exchanger reject it through the facility water loop
  • Energy efficient: highly efficient pumps
PUE ~1.18 (IT + liquid cooling + other) / IT power
Energy Efficiency

Efficiency & Benefits Comparison (PUE)

Lower PUE indicates higher energy efficiency. Liquid cooling demonstrates significant savings.

1.50 1.00 0.50
0 Scenario A: Air Cooling
0 Scenario B: Liquid Cooling
Higher Power Density

Allows for more compute in a smaller footprint.

Reduced OpEx

Significantly lower energy costs and maintenance.

Improved Sustainability

Lower carbon footprint through greater efficiency.

Enhanced Reliability

Stable temperatures for critical hardware.

Liquid-Cooling Topology

Three Interfaces Control Liquid-Cooling Risk

Freeze hydraulics, cleanliness, isolation controls and acceptance evidence at the primary, CDU and rack-side interfaces. Reference basis: 1.6 MW facility / 700 kW IT.

01 · Primary Plant
  • Supply / return / flow / ΔP (pressure differential) frozen at the boundary
  • Flowmeter calibration plus sizing calculation
02 · CDU Boundary
  • Design requirement: N+1
  • Primary / secondary ports with flexible joints
  • Outlet temperature, status and BMS interlink; power, ground and ownership defined
03 · Secondary / Rack Side
  • CDU outlet to rack interlock ball valve
  • 304+ hygienic pipe; prefabricated argon weld
  • Flush, clean and cap before shipment; ring test, isolation and leak collection
Risk ControlPrimary PlantCDU BoundarySecondary / Rack Side
HydraulicsSupply/return, design flow, available ΔPPrimary/secondary ports, capacity, control rangeRing loss, branch balance, rack envelope
CleanlinessWater treatment, makeup ownershipProtect heat exchanger and sensor ports at install304+ hygienic pipe; argon weld, flush, cap
Leak / ServiceIndependent supports, flexible joints, isolationAccessible isolation, traceable replacementInterlock valve, leak detect, pan slope 0.5% / depth 100 mm
Controls / ProofFlow, temperature, valve state, alarm point listOutlet T, status, interlink, power, ground to BMSFAT/SAT: isolation, leak and restoration

Acceptance evidence: flowmeter calibration and calculation, pressure report per section, flush/clean/cap record, site pressure and flush report, BMS point and alarm check, isolation, drain and recovery.

Distribution Manifold & Plumbing

Engineered for Efficiency, Reliability and Precision

The in-rack fluid network: coolant pathways, regulation, connections and protection in next-generation data centers.

In-rack liquid cooling distribution manifold and plumbing render
Distribution manifold and plumbing inside the rack

Fluid Pathway Core

  • Liquid coolant: PG25
  • Spec: 99.9% purity

Regulation

  • Solenoid valves; blind mate (NSEC)
  • Sensors: level / pressure / flow
  • Flow: 500 LPM

Connections

  • EPDM hoses; quick coupling (UQD / UQDB)
  • Flexible metal bellows
  • ID: 12 mm

Protection

  • Leakage detection; O-rings; clamps
  • Leakage threshold: 0.1 ml
High Efficiency

Optimized coolant distribution for maximum thermal performance.

Reliability

Precision components ensure stable operation and long-term durability.

Safety

Leakage protection and real-time monitoring for mission-critical systems.

Scalability

Modular design for easy integration and capacity expansion.

Secondary Coolant

PG25 Secondary-Side Coolant (JEFFCOOL® ISF-25)

Heat-transfer fluid designed for high-density liquid-cooled servers and copper cold plates. Intel-recommended reference fluid.

Low Toxicity & Environmental Profile

Propylene-glycol (PG) based for high safety and lower environmental impact.

Long-Life Corrosion Protection

Proprietary corrosion inhibitors protect copper, brass, stainless steel and titanium.

Intrinsic Biostatic Performance

At 25% concentration, bacterial growth remains under 100 CFU/ml; no supplemental biocides are required.

Stable, Low-Maintenance Operation

Reduces piping-fouling risk associated with microbial growth and lowers routine maintenance frequency.

Technical Specifications · JEFFCOOL® ISF-25
pH8.0–10.5
Freezing Protection-10 °C
Thermal Conductivity @ 50 °C0.475–0.525 W/mK
Specific Heat @ 50 °C> 3.5 kJ/kg-K
Viscosity @ 50 °C1.06 cP
Sulfate<10 ppm
Chloride<5 ppm
Total Hardness (as CaCO3)<20 ppm
Facility Water Quality Requirements & Control Plan

Primary Loop: Water Quality & Reliability

Fully sealed circulation with low makeup demand, designed to protect copper and keep plate heat exchangers clean. The closed loop transfers heat through the plate heat exchanger, and limits follow ASHRAE and equipment water-quality requirements.

ParameterControl LimitEngineering Purpose
pH8.0–8.8Protects copper from corrosion
Conductivity≤ 800 µS/cmReduces electrochemical corrosion
Total Hardness (CaCO3)≤ 50 ppmPrevents heat-exchanger scaling
Chloride (Cl-)≤ 50 ppmPrevents copper pitting
Dissolved Oxygen≤ 0.5 ppmCritical corrosion-control parameter

Release rule: all five limits must pass; any failure blocks system filling. Any source, same acceptance criteria.

Pre-Fill Water Analysis

pH, hardness, conductivity, chloride and dissolved oxygen.

Dedicated Chemical Treatment

Conditioning controls scale and corrosion.

100% Compliance Release

Fill only after all five limits pass.

Closed-Loop Operating Control

Keep sealed; revalidate each makeup batch.

Dry Cooler System

1 MW Containerized Dry Cooler: Cooling & Control

A 40 ft module packages EC fans, V-shaped coils, liquid interfaces and controls for high-density AI data centers.

0kWRated Cooling CapacityCoolant inlet 45 °C / outlet 35 °C; ambient air 27 °C
0fansEC Axial Fans · 19 kW Total3-phase 380–480 VAC, 50/60 Hz
0LPMLiquid-Side FlowMax 1 MPa; drop 40 kPa; DN150 × 2
0kg40 ft Module, DryApprox. 12.20 × 2.45 × 2.90 m, lifting and service access integrated
Chiller System

1 MW Containerized Chiller: Compression & Controls

A 40 ft module packages inverter scroll compressors, EC fans, liquid interfaces and multi-protection for high-density AI data centers.

0kWRated Cooling CapacityCoolant inlet 25 °C / outlet 20 °C; ambient air 30 °C
8+8Inverter Scroll Compressors + EC FansCompressors 22.5 kW × 8; fans 3.5 kW × 8; 380–480 VAC
0LPMLiquid-Side FlowR454B refrigerant; max 1 MPa; DN150 in / out
0kg40 ft Module, DryApprox. 12.20 × 2.45 × 2.90 m; ambient -25 to 43 °C, RH 8–85%
Reference Case

Data Center Cooling Systems Reference Case

A complete heat-rejection chain from DLC rack to cooling tower. Red lines carry hot return water, blue lines carry cold supply.

COOLING TOWER PLATE HX CHILLER 120RT 1+1 CRAH 375 kW CDU + DLC RACK PUMP + FVD 32°C 40°C 13°C
Cooling tower · 500 RT 1+1Final heat rejection to ambient (1,590 kW); 32 °C water returns to the plate heat exchangers.
Plate heat exchangersIsolate the sealed primary loop from tower water and from the IT coolant loop while transferring the full thermal load.
Helical rotary chiller · 120 RT 1+1Trims supply water for the CRAH air loop (375 kW); chiller inlet water 32 °C.
CRAH · 375 kWHandles the residual air-side load; indoor 37 °C, cooled aisle 25 °C.
CDU + DLC rackGPU direct liquid cooling; CDU inlet water 32 °C, return 40 °C. IT workload 1,522 kW with 357 kW air-side dissipation.
Pump group + FVDCirculates primary water with verified flow direction at every branch, behind a check valve.
0kWIT Workload357 kW air-side heat dissipation
32/40°CGPU DLC CDUInlet water 32 °C, return 40 °C
0RTCooling Tower1+1 design, 1,590 kW
37/25°CRoom / Cooled AisleIndoor 37 °C; cooled aisle 25 °C

Ready to Freeze Your Thermal Design?

From CDU selection to facility water chemistry, our engineers close every interface on the list.